Production Capabilities

  • Single Sided, Double Sided, and Multilayer to 24 Layers
  • Quick Turn Production
  • Standard copper ¼ oz. to 4 oz.
  • Heavy copper 5 oz. to 20 oz.
  • Extreme copper up to 200 oz. (12.5lbs/square foot)
  • Laser Plotter - ¼ mil resolution
  • Large Variety of Stock Laminates
  • High Frequency Laminates
  • Hot Air Solder Leveling
  • Immersion Tin
  • Electroless Nickel / Immersion Gold
  • Automatic Optical Inspection
  • Standard 5/5 mil lines and spaces
  • Fine Lines to 3/3 mil lines and spaces
  • Blind (Sequential Build) and Buried Vias
  • Scoring, Milling, Beveling, Counter Boring, Countersinking, Intricate Routing, and Countersinking
  • UL 94 V-O certified
  • ISO 9001:2000 registered
  • Manufacture to IPC-6011, 6012
  • Inspect to IPC 600A
  • Maximum Board Thickness: 0.250”
  • Maximum Layer Count: 24
  • Maximum Inner Layer Copper: 8 oz/ft2 - up to 90 oz/ft2 with Special Processing
  • Standard Total Thickness Tolerance: +/- 10%
  • Maximum Board Size: 16.6” x 22.6”
  • Drill Bits Down to: 0.006”
  • Maximum Hole Size: No Limit
  • Minimum Slot Width: 0.032” Before Plating
  • PTH Drilled 0.004” over nominal (1 oz Plating)
  • Conductor to Board Edge: 0.010”
  • SMT Pitch: 0.014”
  • Layer to Layer Registration: 0.005”
  • Minimum Plating: 0.0008”
  • Maximum PTH Aspect Ratio: 6:1
  • Finish: Plated Tin, SMOBC with HASL ENTEK, Immersion Tin or Gold
  • All Boards Inspected to IPC-6011, 6012
  • Micro-Section Analysis and Reporting